• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic printed circuit board comprising a substrate comprising a base layer and a ceramic insert deposited in the base layer, the base layer being made of an epoxy and fiberglass material; and an electric track deposited on a surface of the base layer and the ceramic insert, as well as a method for manufacturing an electronic circuit board, comprising: inserting a ceramic insert into a mold; injecting an epoxy and fiberglass blend into the mold to form a substrate, wherein the substrate comprises a base layer made of the epoxy and fiberglass blend and the ceramic insert; and forming an electrical track across the ceramic insert and the base layer.
    公开号:BE1025164B1
    申请号:E2017/5380
    申请日:2017-05-26
    公开日:2018-11-28
    发明作者:Frederik Ward Stanny Luppens；Ahmad Sameh Jwania
    申请人:Dk Ceramic Circuits Bvba；
    IPC主号:
    专利说明:

    Electronic circuit board and working method to make it
    Field of Expertise The present application relates generally to electronic circuit boards, and in particular to multi-material electronic circuit boards and methods of making them.
    Background Electronic circuit boards can be used in various electronic modules, such as lighting modules (e.g. automotive vehicle headlights and taillights, etc.). Typically, these electronic circuit boards may have a core made of epoxy and glass fiber (e.g. FR4, FR5, G10, CEM3, etc.), or metal (e.g. aluminum, copper, etc.), or a ceramic material (e.g., A1 2 O 3 , A1N, etc.).
    Generally speaking, epoxy and fiberglass circuit boards have low thermal conductivity and are therefore typically not suitable for use with heat generating components, such as semiconductor devices (e.g. LEDs, etc.). Metal core printed circuit boards are complicated and expensive to manufacture especially when a multi-layer construction is required and have higher expansion coefficients. Consequently, metal core printed circuit boards are typically not suitable for automotive and other lighting modules with complicated electrical circuitry and in addition increase the risk of solder cracking where LEDs (typically small expansion coefficient) are used. Ceramic circuit boards are brittle and subject to breakage or cracking. In addition, all-ceramic circuit boards are expensive to produce.
    There is therefore a need for an improved printed circuit board and a method of making it which addresses one or more of the shortcomings noted above associated with conventional electronic printed circuit boards.
    Summary of the Invention One aspect relates to an electronic printed circuit board with a substrate and an electrical track. The substrate includes a base layer made of a glass fiber epoxy and a ceramic insert deposited in the base layer. The electrical track includes a first end deposited on the base layer and a second end deposited on the ceramic insert. The ceramic insert typically has an area smaller than the area of the base layer. The second end of the electric track is arranged to receive an electric component
    BE2017 / 5380 such that the ceramic insert substantially surrounds a smaller portion of the electronic component.
    Another aspect relates to a method of making an electronic printed circuit board. The method includes producing one or more ceramic inserts separately. The method also includes inserting one or more of the ceramic inserts into a mold, such as an injection mold. The method further includes injecting an epoxy and glass fiber blend into the mold around the ceramic inserts. The injected mixture is allowed to cool to form a substrate. One or more electrical traces and / or electrical platelets are formed on a surface of the substrate.
    Brief Description of the Drawings FIG. 1 is a schematic representation of two electronic circuit boards according to two implementations.
    FIG. 2 is another schematic of two electronic circuit boards according to two other implementations.
    Detailed Description According to various aspects and implementations of the present disclosure, an electronic circuit board comprises a base layer made of an epoxy and glass fiber material, and one or more ceramic plates (e.g. inserts, etc.) deposited in the base layer around a single substrate to define. An electrical track is deposited between the base layer and the one or more ceramic plates to connect an electronic component to one or more circuits on the printed circuit board. One or more heat generating electronic components, such as a power LED, can be coupled to one end of the track located on the ceramic plate. In this manner, at least a smaller portion of the electronic component is substantially surrounded by the ceramic wafer, such that the more thermally conductive wafer can absorb heat energy from the electronic component during operation, rather than the less thermally conductive base layer, thus improving the performance and useful life of this electronic component. In addition, the base layer is made of a material that is less expensive to produce compared to the ceramic plate, so that the overall cost of the printed circuit board is lower.
    In addition, an electronic component with a low thermal expansion coefficient can be coupled to the ceramic wafer using, for example, solder paste. On
    BE2017 / 5380, in this way, the electronic component is mainly surrounded by the ceramic wafer, which has a coefficient of thermal expansion lower than the coefficient of thermal expansion of the base layer, so as to minimize the probability of the solder paste cracking by thermal expansion during operation of the electronic component.
    The printed circuit boards described herein also have a greater degree of mechanical flexibility compared to conventional all-ceramic printed circuit boards, since the ceramic plates are deposited at discrete locations in the base layer such that the more flexible base layer provides the more rigid ceramic plates surrounds. In some implementations, the base layer is made of a flexible epoxy and fiberglass material to allow elastic deformation of the printed circuit board without the risk of the plate tearing or breaking, compared to conventional all-ceramic printed circuit boards.
    The printed circuit boards described herein can be used in various power semiconductor electronic modules. For example, a power semiconductor (e.g. LED, power FET, power BJT, etc.) can be coupled to the ceramic plate for better thermal conductivity during operation, and a lower power semiconductor device (e.g., an electronic drive, digital circuits, etc.). ) can be coupled to the base layer made of the epoxy and fiberglass material, which can be single or multilayer, according to various implementations.
    Referring to FIG. 1, a printed circuit board 10a is shown in the left view according to one implementation. The printed circuit board 10a includes a substrate with a base layer 12a (e.g. base, primary layer, etc.) and a ceramic plate 14a (e.g. insertion, secondary layer, etc.). The ceramic plate 14a and the base layer 12a define a single substrate. In one implementation, the ceramic sheet 14a is inset into the base layer 12a. The ceramic plate 14a has an area smaller than the area of the base layer 12a, such that the base layer 12a substantially surrounds an outer periphery of the ceramic plate 14a. In this way, the substrate is structurally more flexible compared to all-ceramic printed circuit boards. The ceramic plate 14a is arranged to receive an LED for directly coupling an LED to the ceramic plate, so that there is no longer any need for an additional substrate or connector for electronically connecting the LED to an electronic circuit.
    In some implementations, the base layer 12a is made of an epoxy and glass fiber material. The base layer 12a generally has a higher coefficient of thermal expansion
    BE2017 / 5380 and a higher modulus of elasticity compared to the ceramic plate 14a. In some implementations, the ceramic wafer 14a is made of a ceramic material suitable for use in an electronic environment. In some implementations, the ceramic wafer 14a includes a single layer. According to other implementations, the ceramic wafer 14a includes multiple layers. The ceramic wafer 14a has a generally rectangular shape according to one implementation, but it will be appreciated that the ceramic wafer 14a may have other shapes, according to other implementations (e.g., circular, square, octagonal, etc.).
    Still referring to FIG. 1, the printed circuit board 10a additionally includes a plurality of electrical tracks 18a, each of which includes electrical tags 16a deposited at each end of the track. As shown in FIG. 1, the electrical tracks 18a are coupled (e.g., connected, deposited, etc.) between the base layer 12a and the ceramic wafer 14a. In some implementations, the electric track 18a is deposited on the substrate using thin film or thick film technology (e.g. screen printing, etc.). Each electric track includes two plates 16a, according to one implementation. A first slide is deposited on the base layer 12a and the other slide is deposited on the ceramic slide 14a. Each of the electrical plates 16a is arranged to receive an electronic component thereon, such as a power LED or other electronic component. The electronic tracks 18a and plates 16a can, advantageously, allow an electronic component deposited on the ceramic plate 14a to be electronically connected to other electronic components and / or electrical circuits deposited on the base layer 12a, eliminating the need for additional plates or connectors or cables. In some implementations, the electrical tracks 18a can be directly connected to multilayer or single layer circuits on the base layer 12a. By having a greater number of electrical circuits on a single substrate, the number of electrical connections that would be required between multiple circuit boards can be reduced, which in turn increases reliability, and reduces assembly time and overall cost.
    Referring to the right-hand view of FIG. 1, an electronic circuit board 10b is shown according to another implementation. In this implementation, the electronic circuit board 10b comprises a single ceramic plate 14b. The ceramic wafer 14b is generally circular and is surrounded by the base layer 12b, which is also generally circular, according to one implementation. An electric track 18b is coupled (e.g., connected, deposited, etc.) between the base layer 12b and the ceramic plate 14b. The electric track 18b includes first and second plates 18b deposited on the ceramic plate 14b and the base layer 12b, respectively. In some implementations, the electric track 18b can be directly connected to multilayer or single layer circuits on the base layer 22b.
    BE2017 / 5380 Referring to the left view of FIG. 2, an electronic circuit board 20a is shown according to another implementation. In this implementation, the circuit board 20a includes a plurality of ceramic plates 24a deposited in a grid-like pattern on a base layer 22a, although it will be appreciated that the ceramic plates 24a can be deposited in other patterns or formations on the base layer 22a, according to other implementations. According to the implementation shown, the ceramic plates 24a are spaced apart at discrete locations in the base layer 22a. An outer periphery of each of the ceramic plates 24a is surrounded by the base layer 22a. Multiple electrical traces 28a are coupled between the ceramic plates 24a and / or the base layer 22a. According to the implementation shown, one of the electrical tracks 28a is coupled between a pair of ceramic plates 24a. The electric track 28a includes a pair of electrical plates 26a deposited on the pair of ceramic plates 24a, respectively. In this manner, a pair of electronic components can be electrically coupled together via the electrical plates 26a and the electric track 28a. The electronic components deposited on the ceramic plates 24a will be substantially surrounded by the ceramic material to absorb, for example, heat energy and / or provide a mounting surface for the electronic component with low thermal expansion. The other electric track 28a is coupled between a ceramic wafer 24a and a portion of the base layer 22a. In this manner, one or more electronic components deposited on the ceramic plate 24a can be electrically connected to other electronic components and / or electrical circuits on the base layer 22a. In some implementations, the electrical tracks 28a can be directly connected to multilayer or single layer circuits on the base layer 22a.
    The right-hand view of FIG. 2 illustrates an electronic circuit board 20b according to another implementation. In this implementation, the substrate includes a base layer 22b which is generally circular and a plurality of ceramic plates 24b deposited in a concentric pattern on the base layer 22b, according to one implementation. Each of the ceramic plates 24b is generally circular, and is spaced apart from the others such that the base layer 22b substantially surrounds an outline of each of the ceramic plates 24b. The ceramic plates 24b are each adapted to receive an electric track, such as electric track 28b, which is coupled as shown between a ceramic plate 24b and a portion of the base layer 22b. The electrical track 28b includes a pair of electrical plates 26b deposited on the ceramic plate 24b and the base layer 22b, respectively. The electrical plates 26b are each arranged to receive an electronic component thereon. In some implementations, the electric track 28b may be directly connected to one or more multilayer or single layer circuits on the base layer 22b.
    BE2017 / 5380 In another aspect of the present disclosure, a method of making an electronic printed circuit board, such as printed circuit boards 10a, 10b, 20a, 20b, is disclosed herein. The method includes separately manufacturing or producing one or more ceramic plates, such as ceramic plates 14a, 14b, 24a, or 24b shown in FIGN. 1-2. The method also includes inserting the one or more of the ceramic plates into a mold, such as an injection mold. According to one implementation, an epoxy and glass fiber mixture is injected into the mold around the ceramic plates. The injected mixture is allowed to cool to form a substrate. One or more electrical traces and / or electrical plates can be applied to a surface of the ceramic plate and a surface of the base layer, for example by using a thick film technology (for example screen printing) or thin film technology, according to different implementations. In some implementations, a thin metal layer can be added to an upper surface of the substrate and etched using lithographic techniques known to those skilled in the art to define the desired electrical traces.
    The electronic circuit boards disclosed herein can be used in a variety of applications, such as in power LED modules for use in professional lighting applications (e.g., indoor and outdoor), entertainment, automotive lighting applications, military applications, aerospace and aviation applications, industrial applications, heavy machine applications, medical and life science applications, and the like. The electronic circuit boards can also be used in other types of modules and applications, such as in a matrix LED module with full drive electronics, a long-range antenna electronic module, electronic circuits used in environments with large temperature fluctuations where Bluetooth, radio frequency, NFC or other microelectronics are present, and electronic modules for solar applications.
    While this specification contains many specific implementation details, these should not be construed as limitations on the scope of any inventions or what may be claimed, but rather as descriptions of features specific to particular implementations of particular inventions. Certain features described in this specification in the context of separate implementations may also be implemented in combination in a single implementation. Conversely, different features described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable sub-combination. In addition, although features above may have been described as being active in certain combinations and even
    BE2017 / 5380 may initially be so in the claims, one or more features of a claimed combination may in some cases be omitted from the combination, and the claimed combination may be sent to a sub-combination or a variation of a sub-combination.
    References to "or" can be construed as inclusive, so that terms described using "or" any of a single, more than one, and may indicate all of the terms described. The labels “first”, “second”, “third”, etc. are not necessarily intended to indicate an order and have generally been used only to distinguish between similar elements.
    Now that certain implementations have been described, it will become apparent to those skilled in the art that other implementations that integrate the concepts of disclosure may also be used. Accordingly, the disclosure should not be limited to certain implementations, but rather should be limited only by the nature and scope of the following claims.
    权利要求:
    Claims (4)
    [1]
    Conclusions
    1. Electronic printed circuit board, comprising:
    a substrate comprising a base layer and a ceramic insert deposited in the base layer, the base layer being made of an epoxy and glass fiber material; and an electric trace deposited on a surface of the base layer and the ceramic insert.
    [2]
    The electronic circuit board of claim 1, further comprising a light-emitting diode coupled to the ceramic insert and the electrical track.
    [3]
    A method of manufacturing an electronic printed circuit board, comprising:
    inserting a ceramic insertion into a mold;
    injecting an epoxy and glass fiber blend into the mold to form a substrate, the substrate comprising a base layer made of the epoxy and glass fiber blend and the ceramic insert; and forming an electric trace over the ceramic insert and the base layer.
    [4]
    The method of claim 3, further comprising coupling a light-emitting diode to the ceramic insert and the electrical track.
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    同族专利:
    公开号 | 公开日
    BE1025164A1|2018-11-20|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20120329183A1|2010-12-24|2012-12-27|Zheng Wang|Manufacturing method of printing circuit board with micro-radiators|
    US20150257316A1|2014-03-07|2015-09-10|Bridge Semiconductor Corporation|Method of making thermally enhanced wiring board having isolator incorporated therein|
    法律状态:
    2018-12-17| FG| Patent granted|Effective date: 20181128 |
    优先权:
    申请号 | 申请日 | 专利标题
    US201662341981P| true| 2016-05-26|2016-05-26|
    US62341981|2016-05-26|
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